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C110 Copper (ETP — Electrolytic Tough Pitch)

Copper Alloy $$

The standard electrical copper. 99.90% Cu min with controlled oxygen (~0.04% O as Cu₂O) that ties up sulfur and other impurities, preserving conductivity. The benchmark for the IACS conductivity scale — 100% IACS is defined relative to annealed C110. Used wherever electrical or thermal conductivity is the primary requirement: bus bars, wire, electrical contacts, terminals, heat sinks, plumbing tube, architectural cladding (the green-patina'd roofs of old institutional buildings). Soft annealed is gummy and hard to machine; hard-drawn tempers (H02 / H04) machine better but are still rated 20% relative to free-cutting brass.

Service °C
~200°C continuous (above this, annealed structure overages and properties drift)
Tensile
220 MPa annealed (32 ksi) to 455 MPa hard temper (66 ksi)
Density
8.91 g/cm³ (0.322 lb/in³) — about 13% heavier than steel
Cost
$$
$5.50/lb
Trade names: UNS C11000CDA 110C110 ETPCu-ETP / Cu-ETP1ISO Cu-ETPEN CW004AJIS C1100Electrolytic Tough PitchAurubis PNA211

The standard electrical copper. 99.90% Cu min with controlled oxygen (~0.04% O as Cu₂O) that ties up sulfur and other impurities, preserving conductivity. The benchmark for the IACS conductivity scale — 100% IACS is defined relative to annealed C110. Used wherever electrical or thermal conductivity is the primary requirement: bus bars, wire, electrical contacts, terminals, heat sinks, plumbing tube, architectural cladding (the green-patina'd roofs of old institutional buildings). Soft annealed is gummy and hard to machine; hard-drawn tempers (H02 / H04) machine better but are still rated 20% relative to free-cutting brass.

Properties

Mechanical
Mechanical properties for C110 Copper (ETP — Electrolytic Tough Pitch)
Tensile220 MPa annealed (32 ksi) to 455 MPa hard temper (66 ksi)
Yield69 MPa annealed (10 ksi) to 365 MPa hard temper (53 ksi) — strong work-hardening response
Elongation4–55% — annealed 50%+, hard temper ~4%
Modulus115–130 GPa (17,000 ksi typical) — copper is significantly stiffer than aluminum, less than steel
HardnessRockwell B 10 annealed to RB 50+ hard temper; Vickers 69–110 HV
Fatigue strength70–110 MPa (10–16 ksi) endurance limit (10⁸ cycles)
Poisson's ratio0.34
Thermal
Thermal properties for C110 Copper (ETP — Electrolytic Tough Pitch)
Continuous max~200°C continuous (above this, annealed structure overages and properties drift)
Short-term max~400°C short-term; hydrogen embrittlement risk in reducing atmosphere above 370°C
Min service-200°C — Cu is cryogenic-capable; ductility actually increases at low temp
Conductivity391 W/m·K (226 BTU/hr·ft·°F) — the benchmark thermal conductor among engineering metals
CTE17.6 × 10⁻⁶/°C (9.8 × 10⁻⁶/°F)
Specific heat385 J/kg·K
Metal-specific
UNSC11000
ENCu-ETP (CW004A) / DIN 2.0065
Magneticdiamagnetic
Cond.101% IACS
Composition (% wt)
Cu ≥99.90 (incl Ag) O 0.02–0.05 (the controlled oxygen — defines ETP) P ≤0.0005 S ≤0.0015 other_each ≤0.0010

Variants (5)

C110 Annealed (O60) c110-annealed O60

Soft temper. Property data above reflects this state. Used for wire drawing, deep forming, and applications where ductility matters more than strength. Best conductivity.

C110 Half Hard (H02) c110-h02 H02

Cold rolled or drawn to ~25% reduction. Standard temper for plate and bar stock for general use. Better machinability than soft temper while still formable for moderate bending.

C110 Hard (H04) c110-h04 H04

Cold worked to ~37% reduction. Used for hard-drawn wire, electrical bus bars, and high-strength applications. Best balance of strength and conductivity loss (~2–3% IACS reduction).

C110 Spring (H08 / Spring) c110-h08 H08

Spring temper. Used for electrical contact springs and high-strength wire applications. Limited formability.

C110 Hard Drawn Wire (ASTM B1) c110-wire-hard Hard drawn wire

Hard-drawn wire to ASTM B1 — used for overhead transmission lines and high-strength conductor applications. Specific tensile minimums per wire diameter; ~360 MPa min for small gauges.

Processing

Machinability: poor
Chip: Gummy, stringy, work-hardens during cutting. Annealed (soft) temper is the worst — chips smear and re-weld to the tool. Hard-drawn (H02, H04) tempers cut better but still tear and burr.
Gumming: Severe in soft tempers. Copper galls against itself and against most tool materials. Sharp tools, positive rake, and aggressive feeds get under the work-hardened surface. Free-machining additions (Te, Pb, S) are present in C145, C147, C187 alloys for screw-machine work — use those instead of C110 if machinability matters more than 100% IACS.
Finish: 32–63 Ra typical; burrs and tears are the main quality issue, not Ra. Burr removal is a finishing operation in itself for copper parts.
Tooling: Sharp, polished-edge carbide or HSS — coatings (TiN, TiAlN) actively hurt by promoting built-up edge. Speed 200–400 SFM (faster than steel). Feed 0.005–0.015 in/rev — keep moving. Generous positive rake angles (10–20°). Flood coolant (water-soluble emulsion) — non-chlorinated. Hard-drawn temper (H02 / H04) preferred for machined parts.
C110 is fundamentally a poor machining choice — pick a free-machining copper alloy if your part requires significant machining. C145 (tellurium copper, machinability ~90%) or C147 (sulfur copper) retain most of C110's conductivity while machining far more cleanly. C360 free-machining brass machines vastly better but has only ~28% IACS. Reserve C110 for stamped, formed, or wire-drawn parts where machinability doesn't drive selection. Burr removal is a real cost — design parts to minimize machined features.
Weldability: good

ETP copper welds with caveats. The Cu₂O in ETP causes hydrogen embrittlement at the weld zone if the shielding atmosphere isn't tight or if filler/parent has hydrogen pickup. **For welding, OFHC (C101) is strongly preferred over C110** — same conductivity ostensibly, no O₂ to react with H. C110 can be welded but the practical recommendation is to use ERCuSi-A filler (silicon bronze), preheat to 200–540°C for thick sections (Cu's thermal conductivity pulls heat away faster than the arc can deposit it), and use argon shielding (helium for thick sections — higher heat input). Spot welding is poor due to high Cu conductivity. Brazing (with silver alloys) is the more common joining method for ETP copper in production.

Heat treatments
Full Anneal (Soft Temper) (Rockwell B 10 / Vickers 69) — Soft temper for forming. Maximum conductivity. Worst machinability (gummy). Annealing produces grain structure controlled by time- temperature — finer grains for slow / lower-temperature anneals, coarser for higher / longer. Coarse grain in formed parts can cause "orange peel" surface defects in deep drawing.
Stress Relief — Below recrystallization. Used after cold work or machining to relieve residual stress without softening. Critical for cold- drawn parts at risk of SCC in ammonia-bearing environments.
Surface treatments
Electropolishing — Used on decorative Cu parts and on electrical contacts where smooth surface matters for low contact resistance.
Electroless Nickel Plating (5–50 μm) — Common pre-plate for tin or gold plating on electrical contacts. Provides corrosion protection and diffusion barrier. Standard finish on PCB through-hole and surface-mount connector pins.
Hard Chrome Plating (5–250 μm) — Less common on copper than on steel; used on copper printing-press rolls (gravure rolls) for ink/paper contact wear resistance.

Corrosion resistance

general Atmospheric good Cu forms a tenacious dark brown patina (CuO + Cu₂S) then green verdigris (CuCO₃·Cu(OH)₂) over years/decades. The patina is self-limiting — corrosion rate drops to negligible after patina forms (~3 microns/year in industrial atmosphere). The green- roofed institutional buildings of every major American city are this material at the 100-year service mark.
saltwater fair Used in marine service but vulnerable to erosion-corrosion in fast-flowing seawater. Marine condenser tubes are typically Cu-Ni alloys (90/10 or 70/30), not pure Cu. Cu-Ni resists erosion-corrosion that strips C110 in service.
acids poor Attacked by oxidizing acids (nitric, chromic) and by hot sulfuric. Resistant to non-oxidizing organic acids in absence of oxygen (acetic, formic). Sulfuric acid pickling is the standard surface preparation — controlled attack to clean.
bases good Resistant to alkaline solutions except those containing ammonia. Stable in NaOH up to moderate concentrations and temperatures.
oxidizing Environments fair Cu oxidizes rapidly in high-temperature air. Not used in oxidizing acid service.
reducing Environments poor Hydrogen embrittlement in reducing atmospheres at elevated temperature — the C110 Achilles heel. Use OFHC for reducing service.
Cu is one of the more noble engineering metals (above Ni, Sn, Pb, Zn, Al, Mg, Fe in seawater galvanic series, below Ag and Au). In mixed-metal plumbing assemblies, dielectric unions or isolation gaskets are standard. Cu roof drainage onto Al or galvanized gutters causes pitting — common building-envelope failure.
⚠ Galvanic risks with
Aluminum (severe — Al corrodes rapidly)Zinc / galvanized (severe Zn loss)Magnesium (severe)Carbon steel (steel corrodes)Tin (mild — used as protective plating, paradoxically)Lead (mild)

Regulatory

FDA grade
NSF 51
NSF 61
USP Class VI
RoHS
REACH
EU 10/2011

Copper is intrinsically biocidal — it kills bacteria and viruses on contact via reactive oxygen species and Cu ion release. NSF/EPA registered "antimicrobial copper" surfaces are essentially C110 or closely-related alloys. Approved for potable water plumbing (the dominant water service tube material globally) and food contact. Concerns: avoid contact with acidic foods or beverages (citrus, wine fermentation) without tin lining — Cu pickup can cause GI distress and can affect taste.

Notes & applications

Overview

C110 Electrolytic Tough Pitch copper is the standard electrical copper. The composition is 99.90% Cu minimum with a controlled oxygen content (~0.04%) present as fine Cu₂O particles. The oxygen isn’t a defect — it scavenges impurities (sulfur, antimony, bismuth) that would otherwise reduce conductivity if dissolved in solid solution. The result is a metal with conductivity that defines the IACS scale: 100% IACS is by definition annealed C110, and the alloy typically tests slightly above (101% IACS) due to modern refining purity.

What C110 does well:

  • Electrical conductivity — 101% IACS, the benchmark
  • Thermal conductivity — 391 W/m·K, the benchmark
  • Formability in soft temper — wire drawing, deep drawing, spinning, hammering, repoussé
  • Cold work strengthening — H02 / H04 / H08 tempers give controllable strength up to ~450 MPa UTS
  • Brazing and soldering — excellent with proper surface prep
  • Antimicrobial — kills bacteria/viruses on contact
  • Recyclable — Cu recycles at near-100% yield without property loss

What C110 doesn’t do well:

  • Machining — gummy, work-hardens, burrs aggressively. Use a free-machining copper alloy if machinability matters.
  • High-temperature service — anneals and creeps above ~200°C
  • Reducing atmospheres at elevated temp — hydrogen embrittlement
  • Structural service — too soft, creeps under sustained load
  • Cost stability — commodity-priced, swings with copper market

The hydrogen embrittlement trap

C110’s defining feature (controlled Cu₂O) is also its biggest design trap. In hydrogen-bearing atmospheres above ~370°C, the reaction:

Cu₂O + H₂ → 2Cu + H₂O

occurs at grain boundaries inside the metal. The steam (H₂O) generated at temperature has nowhere to go — it ruptures the grain boundaries internally, creating microscopic voids and porosity. The macroscopic result is brittle fracture under loads that the material would otherwise carry easily.

Sources of hydrogen:

  • Welding shielding gas with H₂ content
  • Brazing fluxes containing organic compounds that decompose to H₂
  • Reducing furnace atmospheres (forge or anneal in incorrect atmosphere)
  • Cathodic protection systems overdriving Cu hardware
  • Service exposure to high-pressure H₂ (refinery, hydrogen storage)

The fix is alloy selection — if any of the above will happen, don’t use ETP. Two alternatives:

  • C101 OFHC (Oxygen-Free High Conductivity) — 99.99% Cu min, no controlled oxygen. Same conductivity as ETP, immune to hydrogen embrittlement. The right choice for vacuum tube components, particle accelerators, brazed assemblies, and reducing-atmosphere service. Premium ~30% over ETP.
  • C122 DHP / C12200 (Deoxidized High Phosphorus) — phosphorus used to deoxidize during refining. Lower conductivity (~85% IACS) but cheap and immune to hydrogen embrittlement. The standard for copper plumbing tube and brazed HVAC tubing. The vast majority of “copper pipe” in buildings is C122, not C110.

The general design rule: C110 for electrical, C122 for plumbing/brazing, C101 for vacuum or hydrogen service. ETP is the wrong choice for any brazed or welded assembly that sees stress.

Conductivity vs strength: the inescapable trade-off

Cold working C110 increases strength but reduces conductivity:

Temper UTS Yield Cond. (IACS) Use
O60 (annealed) 220 MPa 69 MPa 101% Wire drawing, deep forming
H02 (1/2 hard) 290 MPa 230 MPa ~100% General sheet/plate
H04 (hard) 350 MPa 310 MPa ~98% Bus bars, hard-drawn wire
H08 (spring) 400 MPa 355 MPa ~96% Contact springs

Pure Cu (annealed) is the benchmark. Cold-working introduces dislocations that scatter electrons, reducing conductivity. The conductivity penalty is modest for moderate cold work (98–100% IACS for H02 / H04) but becomes significant for severe cold work or alloyed coppers.

Alloying for strength reduces conductivity more sharply:

  • C110 ETP: 101% IACS (the reference)
  • C145 Te-Cu (machinable): ~93% IACS
  • C147 S-Cu: ~95% IACS
  • C194 high-conductivity bronze: ~65% IACS
  • C260 brass (70Cu-30Zn): ~28% IACS
  • C510 phosphor bronze: ~15% IACS
  • C932 bearing bronze: ~10–12% IACS

For bus bars sized by current capacity, the conductivity premium of C110 over alternatives pays off in cross-section savings. For mechanical parts with electrical function (contacts, fasteners), moderate conductivity loss is acceptable for the strength gain.

Machining notes: pick a different alloy if you can

C110 is not a machining-grade material. Production parts machined from C110 are economically punishing — slow speeds (or rather, slow effective removal rates), high tool wear, aggressive burring, and gummy chip behavior. The two practical approaches:

  1. Use C110 in soft temper, accept the productivity penalty. Sharp polished-edge HSS or carbide, high speeds (200–400 SFM), aggressive feeds, generous positive rake, flood coolant. Burrs are a real cost — design parts to minimize secondary deburring.

  2. Use a free-machining copper alloy. Conductivity is reduced slightly but still excellent:

    • C145 Tellurium Copper — Te 0.4–0.7%, ~93% IACS, machinability ~90% (vs C110’s ~20%). The standard free-machining copper for electrical components.
    • C147 Sulfur Copper — S 0.2–0.5%, ~95% IACS, machinability ~85%.
    • C187 Te-Pb Copper — Te + Pb, ~93% IACS, machinability ~95%. RoHS concerns due to Pb content.

For most stamped, formed, or drawn copper parts (the dominant production forms), machinability doesn’t drive the decision. For machined screw- machine parts with conductivity requirements, C145 is the right default; for parts where conductivity doesn’t matter, C360 free- machining brass (28% IACS, machinability 100%) is the standard.

Welding considerations

Welding C110 is feasible but rarely the right joining method. The practical considerations:

  • Hydrogen embrittlement risk at the weld zone — Cu₂O reacts with H from shielding gas, filler, or atmosphere. Use OFHC (C101) instead for any welded assembly.
  • Heat sink effect — Cu’s high thermal conductivity (391 W/m·K) pulls heat away from the weld zone faster than the arc deposits it, causing poor fusion. Preheat 200–540°C for thick sections, use helium shielding (higher heat input than argon) for sections >6 mm.
  • Distortion — Cu’s high thermal expansion (17.6 ppm/°C) and conductivity cause severe distortion. Tack-weld extensively, weld in alternating sequence, allow cooling between passes.
  • Spot welding is poor — high conductivity prevents localized resistance heating. Cu electrodes can’t make a heated weld zone on Cu workpiece.

Brazing is the standard joining method for Cu plumbing and HVAC assemblies. Silver-bearing brazing alloys (BCuP-2, BCuP-5, BAg-1) flow well at 600–800°C, much below Cu’s melting point. The Cu₂O issue doesn’t matter for brazing because the brazing temperature is below the H₂ + Cu₂O reaction temperature, and brazing fluxes are designed to be chemically benign.

Soldering for low-stress electrical and plumbing joints — tin- lead historically, lead-free Sn-Cu or Sn-Ag-Cu modern. Easy and reliable on Cu.

Corrosion behavior

Cu develops a patina that protects the underlying metal:

  1. Hours to days: Bright copper dulls to dark brown CuO
  2. Months to years: Brown deepens; copper sulfide (CuS) forms from atmospheric sulfur, especially in industrial areas
  3. Decades: Green Cu carbonate (CuCO₃·Cu(OH)₂) verdigris forms; the familiar institutional-building green roof

Once the patina is established, corrosion rate drops to 1–3 μm/year in industrial atmospheres — essentially negligible for cladding service. C110 architectural cladding lasts a century without maintenance.

Where C110 corrodes faster:

  • Aggressive seawater flow — erosion-corrosion strips the protective film; Cu-Ni alloys preferred
  • Ammonia / amine environments — Cu forms soluble complexes; stress corrosion cracking possible under tension
  • Oxidizing acids — nitric, chromic, hot sulfuric attack Cu
  • Sulfide-rich environments — black sulfide tarnish accelerated
  • Mixed-metal galvanic couples with Al, Zn, Mg, Fe — the less- noble metal corrodes preferentially

Applications by industry

  • Electrical — bus bars, wire, motor windings, transformer windings, electrical contacts, terminals, lugs. The dominant copper application — ~70% of global Cu production goes to electrical use.
  • Plumbing — Type M, L, K copper tube. Most plumbing copper is C122 (deoxidized high phosphorus, brazable) rather than C110, but the alloys are often interchangeable in specifications.
  • HVAC and refrigeration — liquid lines, suction lines, condenser and evaporator tubing. C122 dominant for brazing.
  • Heat exchangers — straight tubes for industrial heat exchange. C71500 (70/30 Cu-Ni) for marine and aggressive service; C12200 (DHP) for general service.
  • Heat sinks — power semiconductor heat sinks, CPU coolers, LED thermal management. C110 for the best conductivity; cost-driven applications use Al with Cu inserts.
  • Architectural — roofing (the green-patina’d institutional buildings), flashing, downspouts, gutters, decorative cladding. Standing-seam Cu roofs last 100+ years.
  • Antimicrobial surfaces — hospital door handles, push plates, bed rails, OR switches. EPA-registered antimicrobial Cu products use C110 or related high-Cu alloys for the contact-kill biocidal effect.
  • Coinage — US Lincoln penny shifted from solid Cu (95% Cu pre-1982) to Cu-plated Zn (~2.5% Cu by mass), but most other circulating coinage worldwide is Cu-alloy based.
  • Renewable energy — DC bus bars in solar inverters and battery storage, grounding rods, wind turbine generator windings.

Failure modes worth designing around

Hydrogen embrittlement — the C110 design trap. Don’t braze, weld, or expose to reducing atmosphere at elevated temperature. Use OFHC (C101) or DHP (C122) for those services.

Stress corrosion cracking in ammonia, amine, and high-pH environments. Common in industrial cooling water systems and fertilizer chemistry. Stress relief anneal cold-worked parts that will see these environments.

Galvanic corrosion of mating metals — aluminum gutters under Cu downspouts, aluminum window frames adjacent to Cu flashing, zinc coatings on screws used in Cu cladding. Always plan for galvanic isolation in mixed-metal exterior assemblies.

Soft temper creep in bolted electrical connections. C110 bus bar joints under continuous current loading creep over time; bolt torque drops, contact resistance rises, joint overheats. Use Belleville washers for spring loading and schedule periodic inspection / re- torque on high-current connections.

Burrs and edge defects from machining cause electrical contact issues, plating defects, and field failures. Specify deburring as a required operation, not an optional one.

Sulfide tarnishing on electrical contacts — black Cu₂S film increases contact resistance. Plate contacts with tin, silver, or gold for stable contact resistance.

Erosion-corrosion in fast-moving seawater. Replace with C70600 (90/10 Cu-Ni) or C71500 (70/30 Cu-Ni) for marine condensers and piping.

Patina staining of adjacent surfaces. Cu runoff stains aluminum, limestone, and concrete green. Architectural detailing includes splash blocks and drainage planning.

Sources & standards

Standards: ASTM B1 (hard-drawn wire for electrical purposes)ASTM B2 (medium hard-drawn wire for electrical purposes)ASTM B3 (soft / annealed wire)ASTM B152 (sheet, strip, plate, rolled bar — the standard plate spec)ASTM B187 (bus bar, rod, and shapes)ASTM B370 (cold-rolled copper sheet/strip for building construction)ASTM B432 (clad copper)SAE J461 / J463 (wrought and cast copper alloys)ASME SB-152 (pressure vessel)EN CW004A (Cu-ETP)DIN EN 13599JIS C1100ISO 1190 / 1338NSF/ANSI 51 (food equipment)NSF/ANSI 61 (drinking water)EPA registered antimicrobial copper surfaces

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